After announcing the flagship Dimensity 1000 chipset for smartphones exactly last month, the company is following it up with its Dimensity 800 series. It’s a mid-range SoC offering affordable 5G solution vs the premium mid-range Kirin 800 and Snapdragon 700 series. Phones with the said chipset are likely to arrive as early as the 1st quarter of 2020. For now, the company is keeping the specs a secret until CES 2020 in Las Vegas.
Mediatek Dimensity 800 to Pave the Way for Affordable 5G Smartphones in 2020
The only known thing about Dimensity 800 is the use of the Helio M70 5G modem. It delivers up to 4.7Gbps download speed and up to 2.5Gbps upload speed. Furthermore, support for SA/NSA networks is also present. Judging by the way the company is releasing SoCs, it seems like Qualcomm and HiSilicon will face a good matchup from MediaTek. The oldest chipset from the three is the Kirin 810, released back in June. Followed by the Snapdragon 765G that was just announced this early December.
Helio processors have always had problems with heat management that causes performance degradation during high-load moments. Hopefully, that gets fixed with the arrival of Dimensity chipsets. And if you’re looking to try the first-ever Dimensity 1000-based phone, Reno3 Pro 5G was just announced together with the Reno3.
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