Just a week ago, we got a leaked image of the Meizu 15 Plus showing off its ultra-thin bezels. It will come with very thin bezels on three sides, with the top one being a bit thicker to house the camera and sensors. Now, live photos surfaced revealing the front and rear of the device.
As we can see in the first photo, Meizu really did a good job at keeping the bezels as thin as possible, making it really look cool. Although the back portion of the phone looks nothing extraordinary.
Also, it was mentioned that the new Meizu flagship will have Snapdragon 845 or Exynos 8895. The leaked live photo of the back portion of the smartphone confirmed that it’s going to have a dual camera setup with an LED flash and laser AF sensor below, similar to the Meizu Pro 6 Plus.
According to the company founder Jack Wong, the phone will arrive for the holiday and will be on sale in March. It may come with a price tag of CNY3,599, which currently translates to $560.
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