During Mobile World Congress Shanghai 2017, Qualcomm Technologies Inc. introduces a new addition to the Snapdragon 400 series – the Snapdragon 450.
First in the 400 series to use 14nm FinFET process, the Snapdragon 450 is designed to deliver better overall performance in battery life, compute and graphics performance, and imaging and LTE connectivity over the Snapdragon 435. The Snapdragon 450 steps closer behind the Snapdragon 625 in overall performance and features.
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The Snapdragon 450 delivers 25% increase in both compute and graphics performance due to a higher performing octa-core ARM Cortex A53 and Adreno 506 GPU. More hours of usage is guaranteed due to the 30 percent reduction of power in gaming, and 0 to 80 percent in 35 minutes of charging is achieved thanks to Quick Charge 3.0 support.
It is also the first in the 400 series to support real-time Bokeh, dual 13+13MP cameras or a single camera up to 21MP and hybrid autofocus for that picture perfect moment. Shooting video at 60fps in 1920×1200 Full HD resolution and Qualcomm Hexagon DSP is also supported.
In terms of connectivity, the Snapdragon 450 is equipped with the Snapdragon X9 LTE modem with downlink speeds of 300Mbps and uplink speeds of 150Mbps and USB 3.0 support.
A lot of firsts in the Snapdragon 450 all the name of bringing advanced mobile functionality at the best possible value. Commercial sampling will begin in Q3 of 2017 and expected to be in consumer devices by the end of 2017.
