Qualcomm will be launching a chipset on 2019 which will contain the SDM855 application processor and the SDX50 5G modem.
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According to Roland Quandt, a renowned tipster, Qualcomm’s next flagship chipset for 2019 will be called the Snapdragon 855. The company’s next modem will be named the Snapdragon X50 which is Qualcomm’s first 5G modem. According to a document presented by Software Japan, the chipset that will contain these two will be called the Snapdragon 855 Fusion Platform. The processor and the modem are expected to be built using 7nm chips.
As seen in the photo provided, the name change from Mobile Platform to Fusion Platform is highly noticeable. A possible reason for this might be Snapdragon being available to PCs in the future and not just for phones and tablets. The new chipset might be released in devices next year. The Snapdragon 855 Fusion Platform might be released in devices next year.
